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Process Development of Lentil flour- based Adhesive for Woodworking Industries
- The aim of this paper was to develop a quality wood adhesive from readily available renewable resource and to reduce significant amount of petroleum based phenol and formaldehyde with biomass. Quality wood adhesive was prepared on the basis of 15.15 % of defatted lentil flour, 59.4 % of phenol and 25.5 % of formaldehyde. The physicomechanical properties of prepared adhesive were measured and compared with standard phenol formaldehyde adhesive. The prepared adhesive was applied successfully in plywood industries, parquet flooring and. particleboard preparation. The prepared adhesive bonded 3-ply plywood has nearly the same shear strength as those of standard phenol formaldehyde (PF) and urea formaldehyde (UP) adhesives. A specific study was made on the preparation and physicomechanical properties of various types of particleboards by using different raw materials, viz, sawdust (wood flour), coir (coconut fibre), straw fibre and bagasse, and 15% w/w of adhesive. The produced particleboards were measured for their thickness, modulus of rupture, water absorption, density and hardness. Findings from these measurements indicated that the prepared adhesive do provide proper bonding of particleboard. The prepared adhesive has been used to produce particleboards having tensile strength (modulus of rupture) and water resistance values equal to those obtained using a standard PF adhesive. Thus, the lentil flour based phenol-formaldehyde adhesive is cost effective and can be used as good quality adhesive in plywood industry, parquet flooring and particleboard makings.
- Universities Research Journal (URJ)